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标签: packaging
此标签下有8条笔记。
2026年8月25日
DASH: Dual-Path HBF for MoE LLM Inference
chiplet
interconnect
tsv
through-silicon-via
hbm
memory
moe
llm
inference
packaging
throughput
latency
serving
kv-cache
architecture
physical-layer
scale-up
storage
2026年8月25日
ReXpert: ReRAM Near-Memory FFN Pool for Disaggregated MoE
chiplet
noc
interconnect
moe
llm
inference
disaggregated-inference
accelerator
memory
packaging
mesh
scale-up
architecture
serving
throughput
latency
2026年8月25日
DICE: Detailed Inter-Chiplet End-to-End PHY Modeling
chiplet
interconnect
noc
scale-up
physical-layer
serdes
fec
retransmission
flow-control
protocol
fabric
communication
packaging
architecture
2026年8月25日
Fovea: Physical-Implication-Aware Wafer-Scale DSE
wse
now
network-on-wafer
noc
interconnect
chiplet
packaging
architecture
training
llm
optimization
2026年8月25日
ThAME: 3D Memory-Enabled Heterogeneous Accelerator for LLM MoE
3d
hybrid-bonding
chiplet
noc
moe
llm
inference
accelerator
memory
interconnect
packaging
architecture
2026年8月25日
Network Design for Wafer-Scale Systems with Wafer-on-Wafer Hybrid Bonding
wse
now
network-on-wafer
wafer-on-wafer
hybrid-bonding
noc
interconnect
chiplet
mesh
routing
3d
packaging
training
llm
architecture
2026年8月24日
Network-on-Wafer
now
network-on-wafer
wafer-on-wafer
wse
noc
interconnect
hybrid-bonding
chiplet
mesh
3d
packaging
fabric
architecture
2026年8月21日
3D Stacking Technologies
3d
tsv
monolithic
hybrid-bonding
interconnect
architecture
packaging
chiplet
wse
noc