AI Infra Wiki

标签: physical-layer

此标签下有7条笔记。

  • 2026年10月06日

    DICE: Detailed Inter-Chiplet End-to-End PHY Modeling

    • chiplet
    • interconnect
    • noc
    • scale-up
    • physical-layer
    • serdes
    • fec
    • retransmission
    • flow-control
    • protocol
    • fabric
    • communication
    • packaging
    • architecture
  • 2026年10月06日

    Through-Silicon Via: A 3D Technology Road Map (and Earlier Survey Work)

    • 3d
    • tsv
    • interconnect
    • through-silicon-via
    • physical-layer
    • architecture
  • 2026年10月06日

    UB 物理层机制

    • interconnect
    • scale-up
    • fabric
    • physical-layer
    • serdes
    • fec
    • link-training
  • 2026年9月25日

    Interconnection Network Protocol Stack

    • interconnect
    • noc
    • protocol
    • physical-layer
    • data-link
    • transport
    • flow-control
    • fabric
    • chiplet
    • serdes
    • fec
    • scale-up
  • 2026年8月28日

    Through-Silicon Via (TSV) Physical Layer

    • 3d
    • tsv
    • physical-layer
    • interconnect
    • through-silicon-via
    • architecture
    • noc
  • 2026年8月28日

    DASH: Dual-Path HBF for MoE LLM Inference

    • chiplet
    • interconnect
    • tsv
    • through-silicon-via
    • hbm
    • memory
    • moe
    • llm
    • inference
    • packaging
    • throughput
    • latency
    • serving
    • kv-cache
    • architecture
    • physical-layer
    • scale-up
    • storage
  • 2026年8月28日

    FLINT: Workload-Driven HBF Substrate for LLM Inference

    • hbf
    • hbm
    • memory
    • tsv
    • through-silicon-via
    • chiplet
    • interconnect
    • physical-layer
    • moe
    • llm
    • inference
    • decode
    • kv-cache
    • serving
    • throughput
    • latency
    • storage
    • packaging
    • architecture
    • huawei

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