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标签: physical-layer
此标签下有7条笔记。
2026年10月06日
DICE: Detailed Inter-Chiplet End-to-End PHY Modeling
chiplet
interconnect
noc
scale-up
physical-layer
serdes
fec
retransmission
flow-control
protocol
fabric
communication
packaging
architecture
2026年10月06日
Through-Silicon Via: A 3D Technology Road Map (and Earlier Survey Work)
3d
tsv
interconnect
through-silicon-via
physical-layer
architecture
2026年10月06日
UB 物理层机制
interconnect
scale-up
fabric
physical-layer
serdes
fec
link-training
2026年9月25日
Interconnection Network Protocol Stack
interconnect
noc
protocol
physical-layer
data-link
transport
flow-control
fabric
chiplet
serdes
fec
scale-up
2026年8月28日
Through-Silicon Via (TSV) Physical Layer
3d
tsv
physical-layer
interconnect
through-silicon-via
architecture
noc
2026年8月28日
DASH: Dual-Path HBF for MoE LLM Inference
chiplet
interconnect
tsv
through-silicon-via
hbm
memory
moe
llm
inference
packaging
throughput
latency
serving
kv-cache
architecture
physical-layer
scale-up
storage
2026年8月28日
FLINT: Workload-Driven HBF Substrate for LLM Inference
hbf
hbm
memory
tsv
through-silicon-via
chiplet
interconnect
physical-layer
moe
llm
inference
decode
kv-cache
serving
throughput
latency
storage
packaging
architecture
huawei