AI Infra Wiki

标签: tsv

此标签下有8条笔记。

  • 2026年8月25日

    DASH: Dual-Path HBF for MoE LLM Inference

    • chiplet
    • interconnect
    • tsv
    • through-silicon-via
    • hbm
    • memory
    • moe
    • llm
    • inference
    • packaging
    • throughput
    • latency
    • serving
    • kv-cache
    • architecture
    • physical-layer
    • scale-up
    • storage
  • 2026年8月25日

    3DLS: A 3D Logic-Stacked Architecture for Disaggregated LLM Serving

    • 3d
    • chiplet
    • hybrid-bonding
    • tsv
    • interconnect
    • disaggregated-inference
    • inference
    • serving-system
    • kv-cache
    • communication
    • llm
    • latency
    • throughput
    • architecture
  • 2026年8月25日

    Through-Silicon Via: A 3D Technology Road Map (and Earlier Survey Work)

    • 3d
    • tsv
    • interconnect
    • through-silicon-via
    • physical-layer
    • architecture
  • 2026年8月25日

    Monolithic 3D: A New Era of Integration (and Earlier Source Lines, e.g., Batude et al. ICCAD 2011)

    • 3d
    • monolithic
    • tsv
    • sequential-integration
    • integration
    • interconnect
    • architecture
  • 2026年8月25日

    Feero & Stan: Networks-on-Chip in a Three-Dimensional Environment (and Related 3D Mesh Baseline Work)

    • 3d
    • mesh
    • tsv
    • noc
    • routing
    • interconnect
    • architecture
    • baseline
  • 2026年8月25日

    Cu-Cu Hybrid Bonding: A New 3D Integration Technology (Multiple 2019–2025 Sources)

    • 3d
    • hybrid-bonding
    • cu-cu
    • microbump
    • tsv
    • interconnect
    • architecture
    • commercial
  • 2026年8月21日

    3D Stacking Technologies

    • 3d
    • tsv
    • monolithic
    • hybrid-bonding
    • interconnect
    • architecture
    • packaging
    • chiplet
    • wse
    • noc
  • 2026年8月21日

    Through-Silicon Via (TSV) Physical Layer

    • 3d
    • tsv
    • physical-layer
    • interconnect
    • through-silicon-via
    • architecture
    • noc

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