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标签: through-silicon-via
此标签下有7条笔记。
2026年10月06日
Through-Silicon Via: A 3D Technology Road Map (and Earlier Survey Work)
3d
tsv
interconnect
through-silicon-via
physical-layer
architecture
2026年8月28日
Through-Silicon Via (TSV) Physical Layer
3d
tsv
physical-layer
interconnect
through-silicon-via
architecture
noc
2026年8月28日
DASH: Dual-Path HBF for MoE LLM Inference
chiplet
interconnect
tsv
through-silicon-via
hbm
memory
moe
llm
inference
packaging
throughput
latency
serving
kv-cache
architecture
physical-layer
scale-up
storage
2026年8月28日
FLINT: Workload-Driven HBF Substrate for LLM Inference
hbf
hbm
memory
tsv
through-silicon-via
chiplet
interconnect
physical-layer
moe
llm
inference
decode
kv-cache
serving
throughput
latency
storage
packaging
architecture
huawei
2026年8月26日
Hot Chips 2026: d-Matrix Raptor 3D-DRAM
d-matrix
3d
hbm
memory
memory-bandwidth
inference
hybrid-bonding
tsv
architecture
chiplet
through-silicon-via
2026年8月26日
Hot Chips 2026: Samsung HBM Base Die (cHBM / aHBM / zHBM)
samsung
hbm
3d
tsv
hybrid-bonding
packaging
chiplet
memory
architecture
through-silicon-via
wafer-on-wafer
2026年8月26日
Hot Chips 2026: SK hynix HBM Advanced Packaging
sk-hynix
hbm
3d
tsv
hybrid-bonding
packaging
memory
architecture
through-silicon-via
microbump
cu-cu