AI Infra Wiki
搜索
Search
暗色模式
亮色模式
探索
标签: hybrid-bonding
此标签下有7条笔记。
2026年8月25日
ThAME: 3D Memory-Enabled Heterogeneous Accelerator for LLM MoE
3d
hybrid-bonding
chiplet
noc
moe
llm
inference
accelerator
memory
interconnect
packaging
architecture
2026年8月25日
3DLS: A 3D Logic-Stacked Architecture for Disaggregated LLM Serving
3d
chiplet
hybrid-bonding
tsv
interconnect
disaggregated-inference
inference
serving-system
kv-cache
communication
llm
latency
throughput
architecture
2026年8月25日
Mozart: Modularized and Efficient MoE Training on 3.5D Wafer-Scale Chiplet Architectures
wse
chiplet
moe
training
hybrid-bonding
3d
noc
interconnect
parallelism
communication
llm
architecture
now
network-on-wafer
2026年8月25日
Network Design for Wafer-Scale Systems with Wafer-on-Wafer Hybrid Bonding
wse
now
network-on-wafer
wafer-on-wafer
hybrid-bonding
noc
interconnect
chiplet
mesh
routing
3d
packaging
training
llm
architecture
2026年8月25日
Cu-Cu Hybrid Bonding: A New 3D Integration Technology (Multiple 2019–2025 Sources)
3d
hybrid-bonding
cu-cu
microbump
tsv
interconnect
architecture
commercial
2026年8月24日
Network-on-Wafer
now
network-on-wafer
wafer-on-wafer
wse
noc
interconnect
hybrid-bonding
chiplet
mesh
3d
packaging
fabric
architecture
2026年8月21日
3D Stacking Technologies
3d
tsv
monolithic
hybrid-bonding
interconnect
architecture
packaging
chiplet
wse
noc