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标签: hybrid-bonding
此标签下有14条笔记。
2026年10月06日
3DLS: A 3D Logic-Stacked Architecture for Disaggregated LLM Serving
3d
chiplet
hybrid-bonding
tsv
interconnect
disaggregated-inference
inference
serving-system
kv-cache
communication
llm
latency
throughput
architecture
2026年10月06日
ThAME: 3D Memory-Enabled Heterogeneous Accelerator for LLM MoE
3d
hybrid-bonding
chiplet
noc
moe
llm
inference
accelerator
memory
interconnect
packaging
architecture
2026年10月06日
Network Design for Wafer-Scale Systems with Wafer-on-Wafer Hybrid Bonding
wse
now
network-on-wafer
wafer-on-wafer
hybrid-bonding
noc
interconnect
chiplet
mesh
routing
3d
packaging
training
llm
architecture
2026年10月06日
Mozart: Modularized and Efficient MoE Training on 3.5D Wafer-Scale Chiplet Architectures
wse
chiplet
moe
training
hybrid-bonding
3d
noc
interconnect
parallelism
communication
llm
architecture
now
network-on-wafer
2026年10月06日
Cu-Cu Hybrid Bonding: A New 3D Integration Technology (Multiple 2019–2025 Sources)
3d
hybrid-bonding
cu-cu
microbump
tsv
interconnect
architecture
commercial
2026年9月10日
3D Stacking Technologies
3d
tsv
monolithic
hybrid-bonding
interconnect
architecture
packaging
chiplet
wse
noc
2026年9月10日
Network-on-Wafer
now
network-on-wafer
wafer-on-wafer
wse
noc
interconnect
hybrid-bonding
chiplet
mesh
3d
packaging
fabric
architecture
2026年9月10日
HDA-MoE: Hybrid Parallelism for MoE on 3D Near-Memory Processing
moe
inference
3d
hybrid-bonding
noc
mesh
scheduling
expert-parallelism
llm
memory
interconnect
accelerator
architecture
parallelism
2026年9月08日
Huawei’s τ Chip Was Supposed to Melt?（LogicFolding / Hybrid Bonding）
3d
hybrid-bonding
power
huawei
interconnect
packaging
architecture
cpu
chiplet
2026年8月27日
Thermal Tuning Overhead in Wafer-Scale Optical Interconnects for LLM MoE Training
now
network-on-wafer
wse
photonic
optical
cpo
wdm
interconnect
hybrid-bonding
3d
packaging
moe
training
llm
architecture
fabric
scale-up
2026年8月26日
Hot Chips 2026: AMD Instinct MI455X
amd
gpu
accelerator
chiplet
hbm
scale-up
ualink
ualoe
hybrid-bonding
architecture
training
inference
quantization
2026年8月26日
Hot Chips 2026: d-Matrix Raptor 3D-DRAM
d-matrix
3d
hbm
memory
memory-bandwidth
inference
hybrid-bonding
tsv
architecture
chiplet
through-silicon-via
2026年8月26日
Hot Chips 2026: Samsung HBM Base Die (cHBM / aHBM / zHBM)
samsung
hbm
3d
tsv
hybrid-bonding
packaging
chiplet
memory
architecture
through-silicon-via
wafer-on-wafer
2026年8月26日
Hot Chips 2026: SK hynix HBM Advanced Packaging
sk-hynix
hbm
3d
tsv
hybrid-bonding
packaging
memory
architecture
through-silicon-via
microbump
cu-cu